Recently, Fibocom launched the next-generation LTE smart module SC636 series, based on the UNIS UIS7861 platform. The series covers regions such as EAU, CN, and LA, with versions supporting only Wi-Fi and Bluetooth communication. These products meet the long lifecycle requirements of scenarios like smart payment, power monitoring, and industrial handheld devices, offering high-value smart module solutions with strong wireless communication, multimedia processing, and scalability.
High Performance and Stability with a Powerful Core
The SC636 series smart module is built on the UNIS UIS7861 platform, integrating a dual-core ARM Cortex-A75 processor and a six-core ARM Cortex-A55 processor with a clock speed of up to 1.6 GHz. It also includes the Arm Mali™-G57 GPU, further enhancing its image processing capabilities. Thanks to its exceptional chip performance, the SC636 series supports multi-tasking and complex calculations, easily meeting the high-performance demands of payment and industrial handheld terminals.
Support for Diverse Network Standards and Positioning Capabilities
As a 4G smart module supporting multiple network standards, the SC636 series supports LTE Cat.4 networks, covering the mainstream frequency bands of global operators, with a maximum downlink speed of 150 Mbps. It offers extensive network coverage and data transmission capabilities, ensuring that payment and industrial devices can maintain stable connections across various network environments. Additionally, the SC636 series supports dual-band Wi-Fi (2.4 GHz and 5 GHz) and Bluetooth 5.0 short-range communication, providing flexible connectivity options to enhance user experience. The module also integrates a multi-constellation GNSS receiver, supporting GPS, BeiDou, GLONASS, and Galileo positioning systems to ensure fast and accurate location tracking in different environments.
Multimedia Functionality for Expanding Use Cases
To support comprehensive upgrades in multimedia performance for smart terminals, the SC636 series supports a maximum main screen resolution of 25201080 @60fps, with single-camera and dual-camera configurations, as well as the ability to operate up to three cameras simultaneously, delivering a high-definition image and video experience. Furthermore, the SC636 series uses a 40.5mm x 40.5mm LCC+LGA package, integrating a wide range of peripheral interfaces such as MIPI, USB, UART, SPI, and I2C, allowing for the connection of touchscreens and supporting dual-camera functionality. This greatly aids customers in expanding external devices and application scenarios.
The Fibocom SC636 series is equipped with the open Android 12 operating system, with future upgrades planned to support Android 14/16, ensuring long lifecycle, high reliability, and continuous upgrades for stable operations.
Multi-Regional Versions to Drive Smart Industry Upgrades
To meet the customized needs of customers in different regions, the SC636 series offers region-specific versions such as SC636-EAU, SC636-CN, and SC636-LA for Europe, China, and Latin America, respectively. It also provides the SC636-W version, which supports only Wi-Fi and Bluetooth, without cellular connectivity. These solutions provide high performance, low power consumption, and reliable security for smart payment, industrial, and other devices, driving further industry upgrades.
As the number of connected smart devices continues to grow, scenarios like smart retail and smart industry are placing new demands on flexibility, reliability, and long lifecycle for intelligent solutions. Fibocom will continue to provide one-stop AIoT solutions for the smart industry, offering global customers safer, more convenient, and more efficient smart experiences.
SIMCOM has launched its new generation intelligent module, the SIM8965 series, targeting the Chinese and global markets. This addition enhances its lineup of smart module products. As a globally recognized provider of IoT modules and solutions, SIMCOM’s rich array of smart modules provides robust support for clients in developing edge computing and on-device AI products.
SIMCOM SIM8965 is an LTE Cat.4 intelligent module built on the Qualcomm SM6115 chipset platform, featuring an 8-core 64-bit ARM Kryo260 processor and Adreno™ 610 GPU with a frequency of up to 2.0GHz. In terms of connectivity, the SIM8965 supports LTE Cat.4, with downlink speeds of up to 150Mbps and uplink speeds of up to 50Mbps, and is compatible with global frequency bands, facilitating data communication across various network types including GSM/GPRS/EDGE, WCDMA/HSPA+, LTE-FDD, and LTE-TDD.
Additionally, this SIMCOM LTE module supports Wi-Fi 5 and Bluetooth 5.1 functionalities, and integrates a multi-constellation GNSS receiver supporting multiple satellite positioning systems such as GPS, BeiDou, GLONASS, Galileo, and QZSS, providing robust network connectivity and high-precision positioning capabilities.
The SIMCOM SIM8965 module excels in image processing, supporting dual cameras of 13MP+13MP or 25MP+5MP, and the main screen supports FHD+ (2520*1080) at 60fps, with encoding capabilities for 1080P at 60fps, ensuring smooth playback and high-quality recording of HD video content. In terms of audio, the SIM8965 supports various audio encoding formats and voice codec technologies, delivering a high-quality voice communication experience.
Moreover, the SIM8965 integrates Android OS, Wi-Fi, Bluetooth, and GNSS functionalities into a single module, simplifying system design, reducing development costs, and enhancing system stability and reliability. The SIM8965 is also compatible with SIMCOM’s SIM8918 series, offering high integration and compatibility for customers’ product innovation and upgrade needs.
With a variety of interfaces, the SIM8965 enhances user experience by offering multiple application possibilities. The module is packaged in LCC+LGA with dimensions of 40.5 x 40.5 x 3.0 mm, incorporating rich interfaces such as MIPI_DSI, CSI, UART, SPI, I2C, GPIO, and USB, allowing for connection with cameras, displays, audio, and sensors for multi-dimensional data collection and human-machine interaction. Its strong application potential in facial recognition, voice recognition, and intelligent detection makes it a reliable ally for digital transformation in fields like smart payment, advertising media, smart vehicles, remote diagnostics, and smart industry.
As the Internet of Things and artificial intelligence technologies rapidly evolve, intelligent modules will play an increasingly vital role as the bridge between the physical and digital worlds. SIMCOM’s new SIM8965 intelligent module, with its high performance, high integration, and rich interface design, contributes significantly to the digital transformation of industries. Additionally, the SIM8965 series features a long lifecycle, meeting customer demands for reliability and stability, with both domestic and global frequency versions available to accommodate differentiated customer needs.
In response to the diverse demands for intelligent modules in the Chinese and global markets, SIMCOM is developing different versions of products with varying computing power, packaging forms, and frequency bands tailored for different countries and regions. In the future, based on a comprehensive range of full-standard and multi-matrix product lines, SIMCOM will continue to innovate and develop high-quality products to promote a brighter future for IoT and artificial intelligence technologies.
During the AIoT Korea Exhibition 2024 in Seoul, FIBOCOM announced the launch of its 5G module FG370-KR, providing outstanding 5G solutions for Korea’s 5G AIoT industry and accelerating the large-scale commercial use of 5G in the country.
According to a 2023 report from the Korea Communications Commission, the number of 5G users in South Korea has reached 32.81 million. Furthermore, global consulting firm Omdia predicts that by the end of 2024, the number of 5G users in South Korea will exceed that of 4G, reaching 69 million by 2028. Currently, the South Korean 5G market is leading globally and shows a strong growth trend. The accelerated commercialization of 5G in Korea is not only generating a wealth of industry applications in sectors such as industrial connectivity, healthcare, smart cities, and entertainment, but is also speeding up the deployment of fixed wireless access (FWA) broadband services. The FIBOCOM 5G module FG370-KR is compatible with mainstream 5G frequency bands in Korea, facilitating the rapid deployment of 5G FWA in the market.
The Fibocom FG370-KR is based on the high-performance MediaTek T830 platform, supporting the 3GPP R16 evolution standard. It utilizes a 4nm process technology and features a quad-core Arm Cortex-A55 CPU, delivering a 10% performance improvement over the previous MediaTek T750 platform. Additionally, the T830 integrates hardware-level MediaTek Network Acceleration Engine and Wi-Fi Offload Engine, providing gigabit-level throughput for 5G cellular network transmission to Ethernet or Wi-Fi without increasing CPU load, thus delivering an exceptional network experience. In terms of 5G speed, the FG370-KR includes the M80 5G modem, supporting Sub-6GHz full-band 5G networks, allowing end customers to enjoy a broadband 5G experience. The FG370-KR supports up to 300MHz bandwidth in FDD and TDD mixed modes, with downlink NR 4CA (four-carrier aggregation) and uplink NR 2CA (two-carrier aggregation), offering downlink speeds of up to 7Gbps. For signal coverage, the FG370-KR supports PC2 technology for High Power User Equipment (HPUE), enhancing 5G uplink capabilities and expanding effective coverage.
The Fibocom FG370-KR supports a variety of peripheral interfaces, including three PCI-Express ports, USB 3.2, and two USXGMII interfaces with speeds of up to 10GbE, and can be expanded with PCM/SPI interfaces to support RJ11 phone interfaces. Meanwhile, the FG370-KR also supports diverse storage configurations, efficiently meeting various storage requirements for different applications.
With MediaTek’s 5G UltraSave power-saving technology, the FG370-KR optimizes its operating mode according to the 5G network environment, reducing communication power consumption and significantly enhancing user experience for broadband access products.
Thanks to these hardware and software features, the FG370-KR will continue to deliver enhanced performance, higher speeds, and greater specialization in comprehensive solutions for end customers. FIBOCOM, as a global leader in MBB FWA solutions, will continue to provide innovative products and solutions for the global 5G market, driving the accelerated development of 5G broadband.
Tao Xi, Vice President of the MBB Product Management Department at FIBOCOM, stated:
“In response to the rapidly developing Korean 5G market, FIBOCOM has launched the high-performance 5G module FG370-KR, helping local operators and end customers achieve commercial success in FWA quickly. Based on the MediaTek T830 platform, the FG370-KR combines powerful 5G features, and its exceptional quality will continue to empower smart homes, enterprise office environments, and other intelligent scenarios. In the future, FIBOCOM will keep providing high-value 5G solutions across various application fields.”
Recently, Quectel’s 5G RedCap module RG255C-GL has successfully passed multiple international certifications for the global market, including GCF global certification, North American FCC, IC, PTCRB certifications, European CE certification, and Australian RCM certification.
This means the Quectel RG255C-GL RedCap module is now fully commercially available and meets the stringent requirements for RedCap network connectivity in markets such as Europe, North America, and Australia. With balanced technical performance, this product provides stable and reliable connectivity support for IoT terminals like CPEs, MiFis, routers, gateways, locators, and industrial PDAs.
RedCap, a lightweight IoT technology derived from 5G NR, achieves cost optimization, size reduction, and lower power consumption by streamlining device capabilities and complexity. Meanwhile, RedCap retains important 5G native features, such as low latency, high reliability, and support for functions like 5G slicing and 5G LAN, making it highly suitable for the digital transformation needs of vertical industries.
Powerful Core, Achieving All-Around Excellence
The Quectel RG255C-GL module is based on the Qualcomm Snapdragon® X35 platform, designed for the global market, and widely compatible with major operators. It complies with the 3GPP R17 standard, supports 5G Sub-6 standalone (SA) mode and LTE Cat 4 networks, and is compatible with Rel-15 (SA) and Rel-16 (SA) networks, meeting the seamless integration and flexible deployment needs of terminal devices. The module also supports low-latency communication and key 5G features such as 5G LAN, uRLLC, and network slicing.
The RG255C-GL achieves a downlink speed of up to 223 Mbps and a peak uplink speed of 123 Mbps, suitable for entry-level FWA applications, video transmission, and mid-to-high-speed IoT requirements.
Additionally, the Quectel RG255C-GL supports the OpenWrt operating system, providing router customers with a wide range of flexible development options. This module also integrates Qualcomm® IZat™ positioning technology, supporting GPS, GLONASS, BDS, Galileo, and NavIC positioning technologies for faster, more precise, and reliable enhanced positioning services.
Compact Design, Demonstrating Exceptional Strength
Not only is the 5G Module powerful in performance, but it also features a sleek and compact design. It uses a compact LGA package, measuring only 32.0 mm × 29.0 mm × 2.4 mm, consistent in size with Quectel’s classic LTE Cat 4 module EG2x series, significantly simplifying the upgrade process for 4G devices, effectively shortening development cycles and reducing costs.
Moreover, the RG255C-GL integrates a rich set of interfaces, including USB 2.0, PCIe 2.0, PCM, UART, SGMII, and SPI, supporting various drivers and software functionalities, expanding its wide-ranging applications in the RedCap field.
In addition, this Quectel 5G module can be paired with various antennas from Quectel, allowing terminal customers to choose compatible antennas based on actual needs, thus reducing costs and accelerating product time-to-market.
Recently, Quectel, a leading global IoT solution provider, announced that its new 5G-A series module RG650V has become the first product based on Qualcomm’s Snapdragon X72 platform to successfully pass GCF/PTCRB certification.
The passing of these two certifications indicates that the Quectel RG650V meets the relevant regulations and standards for regions such as North America, achieving a secure and stable compatibility status with major operators in those regions, providing users with efficient and reliable 5G communication services. Notably, the RG650V has also passed the US FCC certification.
Consistency certification is a key step in bringing IoT devices to market. PTCRB certification focuses on device compatibility and performance on North American operator networks, while GCF is an international product consistency certification. Together, they provide dual assurance for compliant sales of wireless communication devices in key global markets. The RG650V, as the first module based on the Snapdragon X72 platform to pass both certifications, further demonstrates the leading edge of Quectel 5G modules and the company’s overall strength.
Developed on the world’s first 5G Advanced-ready modem and RF system—the Qualcomm Snapdragon X72—the RG650V employs 3GPP Rel-17 technology, supporting 5G NSA and SA modes, as well as Option 3x, 3a, 3, and Option 2 network architectures. It also supports extended 8Rx frequency bands and DL 4 × 4 MIMO technology to enhance 5G network coverage, transmission efficiency, and user experience. Additionally, the series is backward compatible with 4G/3G and supports the latest Wi-Fi 7 technology, introducing up to 4K QAM modulation and 2.4/5/6 GHz Wi-Fi, ensuring stable operation even in areas lacking 5G deployment.
For high-precision positioning applications, the RG650V series incorporates Qualcomm’s advanced IZat™ positioning technology (Gen 9VT) and an optional multi-constellation GNSS receiver, supporting GPS, GLONASS, BDS, Galileo, and QZSS positioning technologies. This enables faster, more accurate, and reliable positioning while simplifying product design and allowing for real-time adjustments based on terminal needs.
To expand the RG650V series’ application possibilities, the module features a range of industrial-standard interfaces, including USB 2.0/3.0/3.1, PCIe 3.0, PCM, and UART. It also comes with the OpenWrt operating system, offering broad and flexible development options for router customers. The series includes RG650V-EU and RG650V-NA versions to meet different regional requirements.
In recent years, the deep integration of 5G with AR/VR, ultra-high-definition video, big data, cloud computing, and the metaverse has driven innovation in 5G applications, creating new business models and experiences. At the same time, new industries present new network connection demands, making 5G-A a timely solution. The new 5G-A module RG650V series from Quectel not only stands out in terms of timeliness and leadership but also excels in performance, supporting the comprehensive upgrade of the communications industry chain and driving rapid digitalization across various sectors.